Technology: Synthetic Jet, Active Thermal Management, High Reliability Cooling: Nuventix SynJet
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Thermal Management Using Synthetic Jet Ejectors
by Raghav Mahalingam and Ari GlezerIEEE Transactions on Components and Packaging Technologies, Vol 27, No3, September 2004
Introduction
Air Spot Cooling Using Synthetic Jet Ejector Technology to Power the Spot Cooler. Hot Spot Thermal Management for Increased Thermal Challenges of Faster Microprocessors
Hot spot thermal management issues exist over a wide range of power dissipation levels, from handheld devices that dissipate a few watts to high-performance microprocessors dissipating over 100 W. Steep cooling requirements have prompted the development of advanced two-phased and pumped liquid cooling techniques. Consumer-oriented systems still focus on air spot cooling approaches due to their simplicity and relative ease of implementation. Forced convection cooling using air is typically based on the use of various configurations of fans and blowers that can fit in medium and large scale enclosures and are used both for global air circulation and for local augmentation (e.g., in conjunction with use of heat sinks for hot spot thermal management).
Work at Georgia Tech over the past several years has demonstrated the utility of synthetic jet actuators for highly efficient localized air spot cooling of integrated circuits.
Because of their ability to direct air flow along heated surfaces in confined environments and induce small-scale mixing, these jets are ideally suited for spot cooler applications at the package and heat sink levels of products with challenging cooling design parameters: for example, chip coolers such as an FPGA cooler.
The present paper reports an investigation of active chip cooling by synthetic jet ejectors in relatively high aspect ratio channels. Section II describes the jet ejector principle and experiments performed in a channel cooled using this concept. Section III presents a spot cooler for high power microprocessors developed using an integrated synthetic jet.
Abstract
The utility of a synthetic jet ejector for localized hot spot thermal management at low flow rates is discussed. An active heat sink for high power microprocessors is developed using the jet ejector concept for active spot cooling and its spot cooler performance is discussed. Applications for synthetic jet ejector technology include an FPGA cooler, other chip cooling, and general microprocessor cooling.
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