Technology: Synthetic Jet, Active Thermal Management, High Reliability Cooling: Nuventix SynJet

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Modeling Of Synthetic Jet Ejectors For Electronics Cooling

by Raghav Mahalingam
SemiTherm 2007

Introduction

Smaller, More Powerful Electronics Demand Better Cooling. Chip Cooling and Many Other Spot Cooling applications Benefit from Synthetic Jet Cooling.

Heat dissipation levels of electronics continue to increase. Consumer-oriented systems still focus on air cooling approaches due to simplicity and ease of implementation (Bar-Cohen [1]). In order to achieve increased local power dissipation levels with fan-heat-sink configurations, designers are forced to use higher-speed fans for applications such as chip cooling, resulting in noise and reliability issues. Another challenge in electronics cooling is the packaging of compact systems such as portables, where in many cases there isn't enough room to even use fans. Previous approaches to thermal management of portable devices have focused primarily on using heat spreaders to distribute the heat to the skin of the portable.

Over the last several years synthetic jets have been researched as an alternative to fans as air moving devices and have been shown to be highly effective for cooling of electronics in a very small form factor.

Because of their ability to direct airflow precisely along heated surfaces in confined environment and induce small scale mixing,synthetic jets are ideally suited for cooling applications at package and heat sink levels and for applications such as spot cooling.

Abstract

This paper presents the modeling results for prediction of thermal performance using synthetic jets ejectors. A synthetic jet is an intense, small-scale turbulent jet synthesized directly from the fluid in which it is embedded.

A jet ejector consists of a primary high momentum jet inducing a secondary flow within a channel. In the work presented here, a 2-D synthetic jet is used as the primary jet causing secondary flow to be induced in a channel. The flow entrainment prediction for the model is based on the solution of mass and momentum equations within the channel. A resistance network model is used to predict the thermal performance. The modeling results are compared with data from past tests of synthetic jet cooling within channels as well as a completely integrated synthetic jet heat sink module.

Applications

Synthetic jets provide, even in a tight form factor, highly efficient and reliable cooling. Chip operating temperatures may have less of an impact on system size as synthetic jet technology is applied to designs.

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This paper examines modeling of synthetic jet technology for spot cooling. Fan technology has drawbacks that synthetic jet technology eliminates. This is an exciting development in chip cooling. Chip cooling and other spot cooling challenges benefit from the high reliability, low power, low noise, and flexible form factor of the synthetic jet.
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