The flexibility of SynJet cooling modules enables product designers to rethink the way that they design their systems. No longer restricted by the design constraints of traditional fan-based technology, products can take on new shapes and sizes. The trade-offs made designing around large, noisy fans are no longer a factor because of the ability to take advantage of the technology used by Nuventix SynJet cooling solutions that can be placed precisely where cooling is needed. The low profile and high thermal efficiency devices fit comfortably in today's ever shrinking mechanical enclosures. Below are a few of the many forms a SynJet solution may take to solve an electronics cooling, each illustrating a unique feature of the technology.
Multi-directional Cooling
In this application the customer had a late-stage design that needed cooling on several different components without resorting to adding ducts or a fan. The solution directed the air from a single SynJet device in four different directions successfully cooling the components.
Asymmetric Cooling
This customer was trying to cool two heat loads with two different thermal efficiencies. The larger load was routed to the larger heat where it could be cooled more aggressively. SynJet flow was divided between the heat sinks. Asymmetric cooling allows use of the right amount of cooling for the right amount of heat, minimizing cost and material usage.
Local Cooling with Bulk Air Exchange
In this design, air was directed over the top and bottom of the hot component, and then a SynJet flow was established to flush the hot air out of the chassis. Local ambient temperatures inside the chassis dropped dramatically along with the case temperature of the component.
Remote Cooling
As designs shrink, hot components get tucked into odd places. Due to the physics of how the SynJet flow is created, the jet itself can form far from the actuator. Remote cooling allows components to be placed creatively in geometries previous thought impractical.
Conformal Cooling
This design exemplified the ease with which SynJet cooling can be integrated into the industrial design of a product. Form follows function, and SynJet cooling can be shaped into nearly any form. In this case, two concentric circles of flow were created to travel down the ID and OD of a cylindrical heat sink.
Decentralized Cooling
This design shows the flexibility of the SynJet technology to cool throughout the system, without having to bring all the heat to a central heat sink. In this product there were two primary heat sources. The SynJet module accomplished this by with Multidirectional Cooling. The designers also wanted to cool a hard drive that was far from the SynJet module. This was accomplished by running a remote jet through the system to cool the bottom side of the hard drive. This combination of Multidirectional Cooling and Remote Cooling is an example of Decentralized Cooling.
Chip Cooler
FPGAs, CPLDs, and ASICs are being placed on daughter cards and motherboards where system cooling is inadequate. In this application a low-profile SynJet module was created to cool a chip on a half-height PCIe card.
Fan Augmentation
Some products are shipping, and want to extend their life by accommodating faster CPUs, memory, or hard drives. SynJet cooling can be used to cool these higher power devices without impacting main airflow and system packaging. In this application server CPU power was increased from 95W to 120W with no changes to the chassis design or system fans.
