SynJet™ fan-less air cooling and hot spot thermal management outpace even the best cooling fans for electronic equipment

The flexibility of SynJet cooling modules enables product designers to rethink the way that they design their systems. No longer restricted by the design constraints of traditional cooling fans for electronic equipment, products can take on new shapes and sizes. The trade-offs made designing around large, noisy fans are no longer a factor because of the ability to take advantage of the technology used by Nuventix SynJet cooling solutions that can be placed precisely where cooling is needed. The low profile and high thermal efficiency devices fit comfortably in today's ever shrinking mechanical enclosures. Below are three of the many forms a SynJet solution may take to solve an electronics cooling challenge, each illustrating a unique feature of the technology.

Multi-directional Cooling and Hot Spot Thermal Management

In this application the customer had a late-stage design that needed cooling on several different components without resorting to adding ducts or a fan. The solution directed the air from a single SynJet device in four different directions successfully cooling the components.

Local Cooling with Bulk Air Exchange

In this design, air was directed over the top and bottom of the hot component, and then a SynJet flow was established to flush the hot air out of the chassis. Local ambient temperatures inside the chassis dropped dramatically along with the case temperature of the component.

Synjet: Provides Remote Cooling Where Cooling Fans for Electronic Equipment Can't

As designs shrink, hot components get tucked into odd places. Due to the physics of how the SynJet flow is created, the jet itself can form far from the actuator. Remote cooling and hot spot thermal management allows components to be placed creatively in geometries previously thought impractical.

Synjet fan-less hot spot thermal management technology is more effective than cooling fans for electronic equipment for almost every application including multi-directional cooling, remote cooling, and local cooling with bulk air exchange.